Ai-WB2-01M Wi-Fi & BLE Module DIP-18 | SDIO SPI UART Multi-Interface IoT Module | AI-Thinker

The Ai-WB2-01M is a Wi-Fi & BLE DIP-18 wireless module designed for embedded IoT applications requiring flexible multi-interface connectivity and reliable dual-mode communication. It supports Wi-Fi 802.11 b/g/n and BLE 5.0, enabling stable wireless data transfer for smart devices and development systems. The module provides SDIO, SPI, UART, and GPIO interfaces, making it highly adaptable for various embedded hardware designs. Its DIP-18 package allows easy prototyping and integration while maintaining strong RF performance, low power consumption, and stable connectivity.

Key Features
DIP-18 through-hole package for easy prototyping
Wi-Fi + BLE dual-mode wireless connectivity
Multiple interfaces: SDIO, SPI, UART, GPIO
Low power consumption for IoT applications
Stable RF performance and reliable communication
Flexible integration for development boards
Strong compatibility with embedded systems
Suitable for rapid prototyping and evaluation

Applications
IoT development platforms
Smart home automation
Wireless sensor networks
Industrial control systems
Educational and prototyping projects
Consumer electronics
Embedded communication modules